Magnesium Sputtering Target

Purity is 4N, Sputtering Targets Shape can be Discs, Rectangle, Plates, Sheets, Tube, Foils, Rods, Taper, Ring.

Back metallisation up to 1600 x 1000mm;

Metallic and non-metallic bond coverage >98%

Ultrasonic c-scan on bond integrity

Sputtering Targets Shape and Size: Discs, Rectangle, Step, Plates, Sheets, Tube, Foils, Rods, Taper, Ring, S-Guns, Custom-Made. Disk targets, column targets, step wafer targets (Dia<350mm, Thickness   >1mm ) 

Rectangle Targets, Slice Targets, Step Rectangle Targets (Longth   <1500mm, Witdh<300mm, Thickness>1mm)      

Tube Target / Rotation   sputtering Target (Outer Dia < 300mm, Thickness > 2mm)

Sputtering  Targets Materials list: Metal sputtering targets: Aluminum (Al),Antimony   (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), Dysprosium (Dy), Erbium  (Er), Europium (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron  (Fe), lanthanum (La), Lead (Pb), Lutetium  (Lu), Manganee   (Mn), Molybdenum (Mo), Magnesium  (Mg),Neodymium  (Nd), Niobiums (Nb), Nickel (Ni), Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb),       Tellurium (Te),Tin   (Sn), Thulium (Tm), Titanium (Ti), Tungsten   (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium  (Zr), Zinc   (Zn)